H15N60
for the manufacture of critical parts in-vacuum devices, electronic connectors technology products, for resistors nepretsizionnyh
for the manufacture of critical parts in-vacuum devices, electronic connectors technology products, for resistors nepretsizionnyh
Standard | Fe, % | Si, % | Mn, % | Cr, % | Ti, % | Ni, % | Al, % | P, % | C, % | S, % |
---|---|---|---|---|---|---|---|---|---|---|
GOST 10994-74 | 17.3–29.2 | 0.8–1.5 | < 1.5 | 15–18 | < 0.3 | 55–61 | < 0.2 | < 0.03 | < 0.15 | < 0.02 |
Standard | Description |
---|---|
GOST 10994-74 |
Parameter | Units of measurement | Description |
---|---|---|
$$E\cdot 10^{9}$$ | $$MPa$$ | Elastic modulus |
$$\alpha\cdot 10^{6}$$ | $$K^{-1}$$ | Coefficient of thermal (linear) expansion (range 20°C–T) |
$$\rho$$ | $$\frac{kg}{m^3}$$ | The density of the material |
$$c\cdot 10^{-3}$$ | $$\frac{J}{kg\cdot K}$$ | The specific heat of the material (range 20°C–T) |
$$R\cdot 10^{-6}$$ | $$\Omega\cdot m$$ | Electrical resistivity |
Parameter | Units of measurement | Description |
---|---|---|
melting point | °C | The temperature at which solid crystalline body makes the transition to the liquid state and Vice versa |
Hot working temperature | °C | The temperature at which the plastic-deformed metal recrystallizes during the pressure treatment |
annealing temperature | °C | The temperature at which the processes return recrystallization and homogenization of the metal to reduce its hardness for subsequent machining |
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